发明名称 HIGH DENSITY VERTICAL NANOWIRE STACK FOR FIELD EFFECT TRANSISTOR
摘要 An alternating stack of layers of a first epitaxial semiconductor material and a second epitaxial semiconductor material is formed on a substrate. A fin stack is formed by patterning the alternating stack into a shape of a fin having a parallel pair of vertical sidewalls. After formation of a disposable gate structure and an optional gate spacer, raised active regions can be formed on end portions of the fin stack. A planarization dielectric layer is formed, and the disposable gate structure is subsequently removed to form a gate cavity. A crystallographic etch is performed on the first epitaxial semiconductor material to form vertically separated pairs of an upright triangular semiconductor nanowire and an inverted triangular semiconductor nanowire. Portions of the epitaxial disposable material are subsequently removed. After an optional anneal, the gate cavity is filled with a gate dielectric and a gate electrode to form a field effect transistor.
申请公布号 US2015372145(A1) 申请公布日期 2015.12.24
申请号 US201414309976 申请日期 2014.06.20
申请人 International Business Machines Corporation 发明人 Cheng Kangguo;Khakifirooz Ali;Li Juntao
分类号 H01L29/78;H01L29/66;H01L29/423;H01L29/06 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor structure comprising at least one semiconductor nanowire pair located over a substrate, wherein each of said at least one semiconductor nanowire pair includes: a lower semiconductor nanowire having a vertical cross-sectional shape of an upright triangle; and an upper semiconductor nanowire having a vertical cross-sectional shape of an inverted triangle.
地址 Armonk NY US