发明名称 Magnetic Assembly
摘要 This invention provides a magnetic assembly which can be used in communication circuit, inverter circuit of electronic equipment. The magnetic assembly is mainly composed of a first substrate, a second substrate and a magnetic element. The first substrate and the second substrate are formed as a pair and spaced with an interval. The magnetic element is assembled between the first substrate and the second substrate and is electrically connected with the first substrate and the second substrate. This invention can effectively minimize the manufacturing cost and the volume of the magnetic element through reducing the overall volume of the substrate.
申请公布号 US2015371750(A1) 申请公布日期 2015.12.24
申请号 US201414311922 申请日期 2014.06.23
申请人 Mag. Layers Scientific-Technics Co., Ltd. 发明人 CHENG Ching-Yuan
分类号 H01F27/02;H01F27/06 主分类号 H01F27/02
代理机构 代理人
主权项 1. A magnetic assembly for electrically assembled on a circuit board, comprising: a magnetic component wrapped with a conductive winding the end of which forms at least one electrical connection terminals; two elongate type substrates; one end edge of each of said substrates forms a plurality of guide grooves, each of said guide grooves being filled with conductive metal which is exposed externally on the side edge of each of said substrates; one plane of each of said substrates has a first electrode electrically connected with said guide groove respectively; wherein, said two substrates are spaced with an interval and said magnetic component is disposed between said two substrates; said electrical connection terminal of said conductive winding of said magnetic component is electrically connected to said first electrode of said substrates, and an enclosure is assembled over said two substrates so as to overlay said magnetic component; an insulation paste layer is filled in between said two substrates.
地址 Hsinchu County TW