SIGNAL TRANSMISSION CIRCUIT AND PRINTED CIRCUIT BOARD

摘要

The present invention aims to improve the signal transmission characteristics by shortening the length of the detour path of the return current. The present invention comprises a return current transmission path relative to a signal transmission path for transmitting signals. The signal transmission path includes a signal pad formed on a circuit board surface layer, and signal through-holes formed on the circuit board surface layer and a circuit board inner layer and connected to the signal pad. The return current transmission path includes a ground pad formed on the circuit board surface layer, and a plurality of ground through-holes formed on the circuit board surface layer and the circuit board inner layer and connected to the ground pad and a ground layer of the circuit board inner layer. Each of the ground through-holes is arranged by being separated on either side of the ground pad.

主权项

1. A signal transmission circuit, comprising:
a return current transmission path against a signal transmission path for transmitting signals, wherein the return current transmission path includes: a ground pad formed on a circuit board surface layer; and a plurality of ground through-holes connected to a ground layer of a circuit board inner layer and the ground pad, wherein the plurality of ground through-holes are configured from ground through-holes that are arranged adjacent to signal through-holes in the signal transmission path, and at least one or more ground through-holes that are arranged on a side opposite to the ground through-holes with the ground pad positioned therebetween.