| 发明名称 |
A circuit on a thin carrier for use in hollow conductors and a manufacturing method |
| 摘要 |
A substrate-based circuit (31) provides a carrier substrate (2), wherein a bond layer (5) is embodied on at least one part of the carrier substrate (2), and wherein a contact layer (6) which forms at least one conductor line (7) and/or at least one antenna element (8) is embodied on at least one first part (51) of the bond layer (5). The carrier substrate (2) provides at least one fastening element (20), which is deposited at the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2). |
| 申请公布号 |
US2015372368(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414764928 |
申请日期 |
2014.01.23 |
| 申请人 |
ROHDE & SCHWARZ GMBH & CO. KG. ;RPG RADIOMETER PHYSICS GMBH |
发明人 |
Pinta Christian;Nagel Mathias;Hechtfischer Gerd;Walber Achim |
| 分类号 |
H01P3/12;H05K3/00;H01P11/00;H05K1/02 |
主分类号 |
H01P3/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a substrate-based circuit with a carrier substrate and with at least one conductor line and/or at least one antenna element arranged respectively on the carrier substrate, characterised by the following method step:
application by deposition of at least one fastening element to an outer region of the carrier substrate, wherein the at least one fastening element projects beyond the outer region of the carrier substrate. |
| 地址 |
München DE |
