| 发明名称 |
MOLD RELEASE FILM AND PRODUCTION METHOD FOR SAME |
| 摘要 |
The present invention provides a mold release film including a resin layer provided on one surface of a polyester film, wherein the resin layer includes 100 parts by mass of a polypropylene-based modified polyolefin resin with the proportion of a modifying component of 1 to 10% by mass and 1 to 50 parts by mass of a cross-linking agent; the peel strength between the resin layer and a pressure-sensitive adhesive measured by bonding a rubber-based pressure-sensitive adhesive to the resin layer exceeds 3.0 N/cm; and the residual adhesion rate of a pressure-sensitive adhesive after bonding an acrylic pressure-sensitive adhesive to the resin layer is 80% or more. |
| 申请公布号 |
US2015367610(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414652311 |
申请日期 |
2014.01.09 |
| 申请人 |
UNITIKA LTD. |
发明人 |
Araki Goro;Okumura Nobuyasu;Ueno Yoshimi |
| 分类号 |
B32B27/08;B05D3/12;B05D1/28;B05D3/02;B32B27/36;B32B27/32 |
主分类号 |
B32B27/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mold release film comprising a resin layer provided on one surface of a polyester film,
wherein the resin layer includes 100 parts by mass of a polypropylene-based modified polyolefin resin with a proportion of a modifying component of 1 to 10% by mass and 1 to 50 parts by mass of a cross-linking agent; a peel strength between the resin layer and a pressure-sensitive adhesive measured by bonding a rubber-based pressure-sensitive adhesive to the resin layer exceeds 3.0 N/cm; and a residual adhesion rate of the pressure-sensitive adhesive after bonding an acrylic pressure-sensitive adhesive to the resin layer is 80% or more. |
| 地址 |
Hyogo JP |
