System And Method For Forming Bonded Substrates

摘要

An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.

主权项

1. An apparatus for bonding a first substrate to a second substrate comprising:
a first roller; a second roller configured to engage the first roller to form a nip; a first heater operatively connected to the first roller and configured to heat the first roller to a first temperature that is greater than a second temperature of the second roller; a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously; and a controller operatively connected the first heater and the substrate transport, the controller being configured to:
activate the first heater to heat the first roller to the first temperature; andoperate the substrate transport to move the first substrate and the second substrate through the nip with a predetermined pattern of a hydrophobic material on the first side of the first substrate engaging a first side of the second substrate, a second side of the first substrate engaging the second roller and a second side of the second substrate engaging the first roller to enable the hydrophobic material in the predetermined pattern to bond the first substrate to the second substrate.