| 摘要 |
<p>A device for continuous heat-treating of at least two multilayer bodies on at least two process levels disposed one beneath another in at least one heating chamber and at least one cooling chamber, which are arranged one after another is described. The heating chamber of the device has a first process level and a second process level. The cooling chamber of the device has a cooling device, the first process level and the second process level.</p> |
