IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING

摘要

Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.

主权项

1. A system for inspecting and processing semiconductor wafers, the system comprising:
an edge detection system for receiving each wafer that is to undergo a photolithography process in a photolithography system prior to the photolithography process being performed on such wafer, wherein the edge detection system comprises:
at least one illumination channel for directing one or more illumination beams towards an edge portion of the wafer, wherein such edge portion includes at least one side and a top, and bottom that are within a border region of the wafer,at least one collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer in response to the one or more illumination beams, andan analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer; and a photolithography system for receiving from the edge detection system each wafer that has been found to be within specification, wherein the edge detection system is coupled in-line with the photolithography system.