METHOD AND APPARATUS FOR DETERMINING SUBSTRATE PLACEMENT IN A PROCESS CHAMBER

摘要

Methods for determining substrate placement in a process chamber are provided herein. In some embodiments, a method for determining substrate placement in a process chamber includes receiving sensor readings from a plurality of sensor arrays attached to the calibration substrate, calculating locations of a plurality of edge locations of a support member beneath the sensors based on the sensor readings, calculating a center point location of the support member based on the locations of the plurality of edge locations of the support member and determining an offset between the center point location and a location of the center of the calibration substrate.

主权项

1. A method for determining substrate placement in a process chamber comprising:
receiving sensor readings from a plurality of sensor arrays attached to a calibration substrate placed in a rough calibration position on a support member; calculating locations of a plurality of edge locations of the support member beneath the sensors based on the sensor readings; calculating a center point location of the support member based on the locations of the plurality of edge locations of the support member; and determining an offset between the center point location and a location of the center of the calibration substrate.