发明名称 MANUFACTURING METHOD OF CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of improving conduction reliability between electrodes by efficiently disposing solder particles on the electrodes.SOLUTION: The manufacturing method of the connection structure according to the present invention includes the steps of: disposing conductive paste containing the plurality of solder particles and a thermosetting component on a surface of a first connection target member; disposing a second connection target member on a surface of the conductive paste opposite to a side of the first connection target member in such a manner that a first electrode and a second electrode confront each other; and heating the conductive paste, such that a connection part connecting the first connection target member and the second connection target member is formed by the conductive paste. In the step of disposing the second connection target member and the step of forming the connection part, pressurization is not performed and a weight of the second connection target member is applied to the conductive paste.
申请公布号 JP2015233162(A) 申请公布日期 2015.12.24
申请号 JP20150189610 申请日期 2015.09.28
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI;KUBOTA TAKASHI
分类号 H05K3/36;H05K3/34 主分类号 H05K3/36
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