发明名称 保護ダイオードを備えた半導体装置
摘要 <p>A protection diode includes a semiconductor substrate having a first region, a second region surrounding the first region, and a third region surrounding the second region; a first insulation layer disposed between the second region and the third region; a first conductive type semiconductor portion disposed in the third region; a second conductive type semiconductor portion disposed in the second region; and a capacity reduction layer disposed in the first region.</p>
申请公布号 JP5835977(B2) 申请公布日期 2015.12.24
申请号 JP20110158929 申请日期 2011.07.20
申请人 ラピスセミコンダクタ株式会社 发明人 平間 厚志;東 真砂彦
分类号 H01L21/822;H01L27/04;H01L29/861;H01L29/868 主分类号 H01L21/822
代理机构 代理人
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