| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inverter device improving a module arrangement structure so as to exhibit a high cooling performance with a small-area heat sink while avoiding generation of mutual thermal interference between a plurality of power integrated modules mounted on the heat sink. <P>SOLUTION: An inverter device has a structure in which an inverter circuit is assembled by combining a plurality of power integrated modules #1 and #2 in each of which a switching circuit part SW and a diode circuit part Di are arranged laterally and housed in one package, and the modules #1 and #2 are juxtaposed and mounted on an air cooling heat sink HS. The diode circuit parts Di of the modules #1 and #2 are selected depending on a circuit form to configure the inverter circuit. The modules #1 and #2 are arranged in two rows in a front-back direction along the flow of cooling air introduced toward the heat sink HS so that the respective switching circuit parts SW of the modules do not overlap with each other in the front-back direction. In some embodiments, the direction of the other module #2 is inverted by 180 degrees to one module #1 and arranged. <P>COPYRIGHT: (C)2012,JPO&INPIT |
