发明名称 SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THEREOF
摘要 A manufacturing method of a semiconductor device having metal gate includes providing a substrate having a first semiconductor device formed thereon, and the first semiconductor device includes a first dummy gate. Next, the dummy gate is removed to form a first gate trench in the first semiconductor device, and the substrate is exposed in a bottom of the first gate trench. Subsequently, an epitaxial channel layer is formed in the first gate trench.
申请公布号 US2015372114(A1) 申请公布日期 2015.12.24
申请号 US201514838361 申请日期 2015.08.27
申请人 UNITED MICROELECTRONICS CORP. 发明人 Hou Yong Tian
分类号 H01L29/66;H01L29/78;H01L21/8238 主分类号 H01L29/66
代理机构 代理人
主权项 1. A manufacturing method of a semiconductor device having metal gate comprising: providing a substrate having at least a first semiconductor device formed thereon, the first semiconductor device comprising a first dummy gate; removing the first dummy gate to form a first gate trench in the first semiconductor device, and the substrate is exposed in a bottom of the first gate trench; and forming an epitaxial channel layer in the first gate trench.
地址 Hsin-Chu City TW