发明名称 |
SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THEREOF |
摘要 |
A manufacturing method of a semiconductor device having metal gate includes providing a substrate having a first semiconductor device formed thereon, and the first semiconductor device includes a first dummy gate. Next, the dummy gate is removed to form a first gate trench in the first semiconductor device, and the substrate is exposed in a bottom of the first gate trench. Subsequently, an epitaxial channel layer is formed in the first gate trench. |
申请公布号 |
US2015372114(A1) |
申请公布日期 |
2015.12.24 |
申请号 |
US201514838361 |
申请日期 |
2015.08.27 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Hou Yong Tian |
分类号 |
H01L29/66;H01L29/78;H01L21/8238 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method of a semiconductor device having metal gate comprising:
providing a substrate having at least a first semiconductor device formed thereon, the first semiconductor device comprising a first dummy gate; removing the first dummy gate to form a first gate trench in the first semiconductor device, and the substrate is exposed in a bottom of the first gate trench; and forming an epitaxial channel layer in the first gate trench. |
地址 |
Hsin-Chu City TW |