| 发明名称 |
CIRCUIT-AND-HEAT-DISSIPATION ASSEMBLY AND METHOD OF MAKING THE SAME |
| 摘要 |
A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer. |
| 申请公布号 |
US2015373832(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201514744469 |
申请日期 |
2015.06.19 |
| 申请人 |
Taiwan Green Point Enterprises Co., Ltd. |
发明人 |
LIAO Pen-Yi;PAN Hung-San;CHEN Yu-Cheng;CHUANG Hui-Ching;TSAI Wen-Chia |
| 分类号 |
H05K1/02;H05K3/10 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit-and-heat-dissipation assembly, comprising:
a heat sink including a heat absorbing base and a heat dissipating element, said heat absorbing base having a circuit-forming surface and an element-forming surface, said heat dissipating element protruding from said element-forming surface for dissipating heat conducted from said heat absorbing base into an ambient environment; an insulator layer formed on said circuit-forming surface; and a patterned circuit formed on said insulator layer. |
| 地址 |
Taichung City TW |
