发明名称 Apparatus and Method for Multiple Gate Transistors
摘要 A method comprises etching away an upper portion of a substrate to form a trench between two adjacent isolation regions, wherein the substrate has a first crystal orientation and is formed of a first semiconductor material, growing a first semiconductor region in the trench over the substrate, wherein the first semiconductor region is formed of a second semiconductor material and an upper portion of the first semiconductor region has a second crystal orientation and growing a second semiconductor region over the first semiconductor region, wherein the second semiconductor region is formed of a third semiconductor material.
申请公布号 US2015372116(A1) 申请公布日期 2015.12.24
申请号 US201514841480 申请日期 2015.08.31
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Vellianitis Georgios
分类号 H01L29/66;H01L29/04;H01L29/165;H01L21/306;H01L29/78;H01L29/06;H01L21/02 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method comprising: etching away an upper portion of a substrate to form a trench between two adjacent isolation regions, wherein the substrate has a first crystal orientation and is formed of a first semiconductor material; growing a first semiconductor region in the trench over the substrate, wherein the first semiconductor region is formed of a second semiconductor material and an upper portion of the first semiconductor region has a second crystal orientation; and growing a second semiconductor region over the first semiconductor region, wherein the second semiconductor region is formed of a third semiconductor material.
地址 Hsin-Chu TW