| 摘要 |
A lamp unit of an embodiment of the present invention comprises: a metal substrate; an insulating layer arranged on the metal substrate; a first conductive layer arranged on the insulating layer; a plurality of light emitting chips arranged on the first conductive layer; and a protecting layer arranged on the insulating layer. Each of the light emitting chips comprises: a light emitting structure including a first conductive semiconductor layer; a second conductive semiconductor layer, and an active layer arranged between the first conductive semiconductor layer and the second conductive semiconductor layer; a first electrode arranged on the first conductive semiconductor layer; and a second electrode arranged on the second conductive semiconductor layer. The second electrode is bonded to the first conductive layer. |
