HIGH DENSITY FILM FOR IC PACKAGE

摘要

The present invention discloses a high density film for IC package. The process comprises: a redistribution layer is fabricated following IC design rule, with a plurality of bottom pad formed on bottom, and with a plurality of first top pad formed on top; wherein the density of the plurality of bottom pad is higher than the density of the plurality of first top pad; and a top redistribution layer is fabricated following PCB design rule, using the plurality of the first top pad as a starting point; with a plurality of second top pad formed on top; wherein a density of the plurality of first top pad is higher than a density of the plurality of second top pad.

主权项

1. An integrated circuit (IC) package, comprising:
a bottom redistribution layer fabricated according to IC design rule, the bottom redistribution layer having
a plurality of bottom pads formed on a bottom of the bottom redistribution layer, anda plurality of first top pads formed on a top of the bottom redistribution layer, wherein a density of the plurality of bottom pads is higher than a density of the plurality of first top pads; and a top redistribution layer fabricated according to PCB design rule, the top redistribution layer formed on the plurality of the first top pads and having a plurality of second top pads formed on a top of the top redistribution layer, wherein the density of the plurality of first top pads is higher than a density of the plurality of second top pads.