| 发明名称 |
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME |
| 摘要 |
A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body. |
| 申请公布号 |
US2015371755(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414504107 |
申请日期 |
2014.10.01 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
IM Jeong Hwan;JUN So Young;JUNG Hyun Ju;PARK Sung Jin;HA Young Jin |
| 分类号 |
H01F27/28 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer electronic component comprising:
a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively, wherein a perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body is smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body. |
| 地址 |
Suwon-Si KR |
