| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
There are provided a printed circuit board and a method of manufacturing the same. According to an exemplary embodiment of the present disclosure, a printed circuit board includes: an insulating layer; a first outer layer circuit pattern formed in a lower portion of the insulating layer to be embedded in the insulating layer; and a second outer layer circuit pattern formed on the insulating layer to protrude from the insulating layer. |
| 申请公布号 |
US2015373833(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414488225 |
申请日期 |
2014.09.16 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BAEK Yong Ho;Nam Hyo Seung;Choi Jae Hoon;Lee Eung Suek;Lee Jeong Ho |
| 分类号 |
H05K1/02;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board, comprising:
an insulating layer; a first outer layer circuit pattern formed in a lower portion of the insulating layer to be embedded in the insulating layer; and a second outer layer circuit pattern formed on the insulating layer to protrude from the insulating layer. |
| 地址 |
Suwon-Si KR |
