发明名称 METHOD FOR MANUFACTURING DROPLET-DISCHARGE HEAD SUBSTRATE AND DROPLET-DISCHARGING HEAD
摘要 An embodiment method for manufacturing a droplet-discharging head substrate may include a first step to perform a surface activation process on joint surfaces of first and second plates with an atom beam, ion beam or plasma; a second step to align and stack the first and second plates in such a manner that nozzle holes formed in the first plate communicate with through-holes formed in the second plate; and a third step to bond the joint surfaces of the stacked first and second plates by atomic bonding without covalent bonding caused by ion movement. The third step bonds the joint surfaces by bringing a load member into contact with the droplet-discharging surface of the first plate at a position away from the nozzle holes to apply pressure under an atmospheric pressure and by bringing the joint surfaces close to each other with an electrostatic attractive force.
申请公布号 US2015367645(A1) 申请公布日期 2015.12.24
申请号 US201414764753 申请日期 2014.01.21
申请人 KONICA MINOLTA. INC. 发明人 KOZAI Hiroaki
分类号 B41J2/16 主分类号 B41J2/16
代理机构 代理人
主权项 1. A method for manufacturing a droplet-discharging head substrate, the substrate including: a first plate having a plurality of nozzle holes to discharge droplets; and a second plate bonded to, of the first plate, a surface opposite to a droplet-discharging surface from which the droplets are discharged, the second plate having a plurality of through-holes communicating with the respective nozzle holes to form a plurality of flow paths, the method comprising: a first step to perform a surface activation process on joint surfaces of the first and second plates with an atom beam, an ion beam, or a plasma as an energy wave; a second step to align and stack the first and second plates in such a manner that the nozzle holes formed in the first plate communicate with the respective through-holes formed in the second plate; and a third step to bond the joint surfaces of the stacked first and second plates to each other by atomic bonding without covalent bonding caused by ion movement, wherein the third step bonds the joint surfaces by bringing a load member into contact with the droplet-discharging surface of the first plate at a position away from the nozzle holes and applying a pressure to the droplet-discharging surface under an atmospheric pressure, and by bringing the joint surfaces close to each other with an electrostatic attractive force generated between the joint surfaces.
地址 Tokyo JP