| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which has high flexibility to a device with TSV which highly requires thinning and high density arrangement; and provide an electronic device using the wiring board.SOLUTION: A wiring board comprises: a semiconductor substrate 1; a Zener diode ZD; and a first vertical conductor 31 and a second vertical conductor 32 which compose paired current paths. The Zener diode ZD includes: an N-type semiconductor region 112 and a P-type semiconductor region 111 which are composed of the semiconductor substrate 1; and PN junction 113 extending in a thickness direction of the semiconductor substrate 1. The first vertical conductor 31 and the second vertical conductor 32 pierce the semiconductor substrate 1 in a thickness direction. The first vertical conductor 31 contacts the N-type semiconductor region 112 and the second vertical conductor 32 contacts the P-type semiconductor region 111.</p> |
