发明名称 |
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
According to one embodiment, a nonvolatile semiconductor memory device, includes: a foundation layer; a stacked body provided on the foundation layer, each of a plurality of first insulating layers and each of a plurality of electrode layers being stacked alternately in the stacked body; a first layer provided between the stacked body and the foundation layer, the first layer including semiconductor, one portion of the first layer on a side of the stacked body including metal; a pair of first semiconductor members extending through the stacked body in a stacking direction of the stacked body; a memory film provided between each of the first semiconductor members and each of the plurality of electrode layers; a second semiconductor member provided inside the first layer and connected to the pair of first semiconductor members; and an insulating film provided between the second semiconductor member and the first layer. |
申请公布号 |
US2015372003(A1) |
申请公布日期 |
2015.12.24 |
申请号 |
US201514638493 |
申请日期 |
2015.03.04 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
NODA Kotaro |
分类号 |
H01L27/115;H01L21/285;H01L21/311;H01L21/28 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A nonvolatile semiconductor memory device, comprising:
a foundation layer; a stacked body provided on the foundation layer, each of a plurality of first insulating layers and each of a plurality of electrode layers being stacked alternately in the stacked body; a first layer provided between the stacked body and the foundation layer, the first layer including semiconductor, one portion of the first layer on a side of the stacked body including metal; a pair of first semiconductor members extending through the stacked body in a stacking direction of the stacked body; a memory film provided between each of the first semiconductor members and each of the plurality of electrode layers; a second semiconductor member provided inside the first layer and connected to the pair of first semiconductor members; and an insulating film provided between the second semiconductor member and the first layer. |
地址 |
Minato-ku JP |