发明名称 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 According to one embodiment, a nonvolatile semiconductor memory device, includes: a foundation layer; a stacked body provided on the foundation layer, each of a plurality of first insulating layers and each of a plurality of electrode layers being stacked alternately in the stacked body; a first layer provided between the stacked body and the foundation layer, the first layer including semiconductor, one portion of the first layer on a side of the stacked body including metal; a pair of first semiconductor members extending through the stacked body in a stacking direction of the stacked body; a memory film provided between each of the first semiconductor members and each of the plurality of electrode layers; a second semiconductor member provided inside the first layer and connected to the pair of first semiconductor members; and an insulating film provided between the second semiconductor member and the first layer.
申请公布号 US2015372003(A1) 申请公布日期 2015.12.24
申请号 US201514638493 申请日期 2015.03.04
申请人 Kabushiki Kaisha Toshiba 发明人 NODA Kotaro
分类号 H01L27/115;H01L21/285;H01L21/311;H01L21/28 主分类号 H01L27/115
代理机构 代理人
主权项 1. A nonvolatile semiconductor memory device, comprising: a foundation layer; a stacked body provided on the foundation layer, each of a plurality of first insulating layers and each of a plurality of electrode layers being stacked alternately in the stacked body; a first layer provided between the stacked body and the foundation layer, the first layer including semiconductor, one portion of the first layer on a side of the stacked body including metal; a pair of first semiconductor members extending through the stacked body in a stacking direction of the stacked body; a memory film provided between each of the first semiconductor members and each of the plurality of electrode layers; a second semiconductor member provided inside the first layer and connected to the pair of first semiconductor members; and an insulating film provided between the second semiconductor member and the first layer.
地址 Minato-ku JP