| 发明名称 |
Integrated Circuit Packaging Method Using Pre-Applied Attachment Medium |
| 摘要 |
A method of making an IC package having a die and a substrate that are to be attached at an attachment station including providing the die and substrate and, at a location remote from the attachment station, coating at least one of the die and a die attachment portion of the substrate with attachment medium. |
| 申请公布号 |
US2015371930(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414307880 |
申请日期 |
2014.06.18 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Merto Ruby Ann Maya;Samson Roxanna Bauzon |
| 分类号 |
H01L23/495;H01L23/00;H01L21/56 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of making a QFD package having a QFD stack that is to be assembled at a stack assembly station comprising:
providing a leadframe for the QFD; and at a location remote from a QFN stack assembly station, coating at least a portion of the leadframe with attachment medium to provide a coated leadframe. |
| 地址 |
Dallas TX US |
