发明名称 THIN END EFFECTOR WITH ABILITY TO HOLD WAFER DURING MOTION
摘要 Embodiments of the invention include methods and apparatuses for removing a carrier ring assembly from a carrier that includes tightly pitched slots. Embodiments include a robot arm that comprises an end effector wrist, an end effector that has a maximum thickness less than approximately 3.0 mm and a gripping device for securing a carrier ring assembly to the end effector. According to an embodiment, the gripping device may be a clamping member. One or more actuators may be used to displace the clamping member in a direction relative to the end effector. In an additional embodiment, the gripping device may be an electromagnetic device that includes a plurality of electromagnets that are inserted into a top surface of the end effector. Embodiments further include a vacuum gripping device that includes openings in a top surface of the end effector that are coupled to a vacuum controller by air-lines.
申请公布号 WO2015195230(A1) 申请公布日期 2015.12.23
申请号 WO2015US30620 申请日期 2015.05.13
申请人 APPLIED MATERIALS, INC. 发明人 MAZZOCCO, JOHN;GREENBERG, DANIEL
分类号 H01L21/677 主分类号 H01L21/677
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