PHENOL RESIN FOAM AND METHOD FOR MANUFACTURING SAME

摘要

The purpose of the present invention is to provide a phenol resin foam having low initial thermal conductivity, and in which low thermal conductivity is maintained for a long time. This phenol resin foam contains cyclopentane and a high-boiling hydrocarbon having a boiling point of 120°C to 550°C, and has a density of 10 kg/m3 to 150 kg/m3, and the cyclopentane content in the phenol resin foam is 0.25-0.85 mol with respect to a spatial volume of 22.4×10-3m3 in the phenol resin foam.