LED module

摘要

According to one embodiment, an LED module (1, 2, 3, 4, 5, 6, 6a, 6b, 6c, 6d, 6e) includes a board (21, 31, 37), an interconnection (22) and an LED package (14). The interconnection (22) is formed on an upper surface of the board (21, 31, 37). The LED package (14) is mounted on the board (21, 31, 37). The LED package (14) includes first and second lead frames (101, 103) disposed to be apart from each other, and connected to portions of the interconnection (22) insulated from each other. The LED package (14) includes an LED chip (104) provided above the first and second lead frames (101, 103). The LED chip (104) has one terminal (104a) connected to the first lead frame (101) and another terminal (104b) connected to the second lead frame (103). In addition, the LED package (14) includes a resin body (107) covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames (101, 103), also covering the LED chip (104), but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body (107) is an appearance of the LED package (14).