| 摘要 |
An embodiment of the present invention relates to a light-emitting element, a manufacturing method thereof, a light-emitting element package, and a lighting system. The light-emitting element according to an embodiment of the present invention comprises: a light-emitting structure layer including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; multiple recesses penetrating through the light-emitting structure layer from the bottom thereof to expose a part of the first conductivity type semiconductor layer; a first contact electrode electrically connected through the multiple recesses to the first conductivity type semiconductor layer; an insulation layer interposed between the first contact electrode and the multiple recesses; a first electrode layer electrically connected to the first contact electrode; and a second contact electrode electrically connected to the second conductivity type semiconductor layer. |
