发明名称 |
A METHOD FOR BONDING A CHIP TO A WAFER |
摘要 |
A method for chip on wafer bonding is provided. The method includes the formation of a plurality of posts on at least one of a chip and a wafer, and a like plurality of contacts on the other of the chip and the wafer. After formation, a contact surface of each post is planarized, the respective planarized contact surface having a surface roughness height. A bonding material is then applied to at least one of the chip in a thickness no greater than the surface roughness height of the contact surface. The posts are then temporarily bonded to the contacts using the bonding material to stabilize a position of the chip relative to the wafer for permanent diffusion bonding of the chip to the wafer. |
申请公布号 |
WO2015195052(A1) |
申请公布日期 |
2015.12.23 |
申请号 |
WO2015SG50173 |
申请日期 |
2015.06.22 |
申请人 |
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH |
发明人 |
WICKRAMANAYAKA, SUNIL;XIE, LING;AW, JERRY JIE LI |
分类号 |
H01L21/98;H01L23/13;H01L23/48;H01L23/52;H01L25/00 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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