发明名称 |
SEMICONDUCTOR DEVICE, PACKAGE DEVICE, LIGHT-EMITTING PANEL APPARATUS, WAFER AND METHOD OF PRODUCING A SEMICONDUCTOR DEVICE |
摘要 |
<p>There is provided a semiconductor device (101), including: a first semiconductor layer (25) having a main surface that is a growth surface in a lamination direction and a first side surface (251) disposed at a first angle; and a second semiconductor layer (24) adjacent the first semiconductor layer (25) having a second side surface (241) extending from the first side surface (251) of the first semiconductor layer (25) at a second angle different from the first angle.</p> |
申请公布号 |
WO2015194095(A1) |
申请公布日期 |
2015.12.23 |
申请号 |
WO2015JP02561 |
申请日期 |
2015.05.21 |
申请人 |
SONY CORPORATION |
发明人 |
OKUYAMA, HIROYUKI |
分类号 |
H01L33/20;H01L33/22;H01L33/30 |
主分类号 |
H01L33/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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