发明名称 HIGH-STRENGTH Cu-Ni-Co-Si BASE COPPER ALLOY SHEET, PROCESS FOR PRODUCING SAME, AND CURRENT-CARRYING COMPONENT
摘要 [Problem] To provide a copper alloy sheet material that has a very high strength of a 0.2% offset yield strength of 980 MPa or more, and is good in the conductivity, the stress relaxation resistance property and the press workability. [Solution] A copper alloy sheet material: having a chemical composition containing from 2.50 to 4.00% in total of Ni and Co, from 0.50 to 2.00% of Co, from 0.70 to 1.50% of Si, from 0 to 0.50% of Fe, from 0 to 0.10% of Mg, from 0 to 0.50% of Sn, from 0 to 0.15% of Zn, from 0 to 0.07% of B, from 0 to 0.10% of P, from 0 to 0.10% of REM (rare earth elements), from 0 to 0.01% in total of Cr, Zr, Hf, Nb and S, the balance of Cu, and unavoidable impurities, all in terms of percentage by mass; having a number density of coarse secondary phase particles having a particle diameter of 5 µm or more of 10 per mm 2 or less, and a number density of fine secondary phase particles having a particle diameter of from 5 to 10 nm of 1.0 × 10 9 per mm 2 or more; and having an Si concentration in the parent phase of 0.10% by mass or more.
申请公布号 EP2957646(A1) 申请公布日期 2015.12.23
申请号 EP20140750978 申请日期 2014.02.10
申请人 DOWA METALTECH CO., LTD 发明人 KIMURA TAKASHI;KAMADA TOSHIYA;GAO WEILIN;SASAKI FUMIAKI;SUGAWARA AKIRA
分类号 C22C9/06;C22F1/08;H01B1/02;H01B5/02;H01B13/00 主分类号 C22C9/06
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