CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS

摘要

The present disclosure is directed to a curable precursor of a pressure sensitive adhesive composition comprising: (1) a free-radically polymerizable material comprising at least one free-radically polymerizable monomer; (2) a polymerization initiator system, comprising: a) a thermal redox initiator system, consisting of: i. a thermal polymerization initiator comprising an organic peroxide; and ii. an accelerator selected from the group consisting of tertiary amines, metal salts, mercaptans, and any combinations or mixtures thereof; and b) a photoinitiator. The present disclosure is also directed to a method of manufacturing such pressure sensitive adhesives and uses thereof.