SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a semiconductor package, and a manufacturing method thereof. More specifically the present invention relates to a semiconductor package, and a manufacturing method thereof which include: forming with a structure for penetrating a molding unit by directly attaching a heat wire on a main semiconductor die, thereby increasing heat radiation efficiency by directly discharging heat generated in the main semiconductor die to the outside; omitting a heat slug process and an oven cure process; applying with the existing equipment without having additional equipment investment, thereby having no financial burden; having no mark caused by heat slug during a molding process, thereby a cleaning process being unnecessarily needed when converting into a normal package so as to reduce costs and increase yield.