发明名称 |
CURABLE RESIN COMPOSITION, CURED PRODUCT, SEALING MEMBER SEMICONDUCTOR DEVICE |
摘要 |
Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard. |
申请公布号 |
EP2957599(A4) |
申请公布日期 |
2015.12.23 |
申请号 |
EP20140751942 |
申请日期 |
2014.02.04 |
申请人 |
DAICEL CORPORATION |
发明人 |
KAMURO, SHIGEAKI;NAKAGAWA, YASUNOBU |
分类号 |
C08L83/04;C08K5/3477;C08K5/54;C08L83/05;C08L83/07;H01L33/56 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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