WAFER LEVEL TRANSFER MOLDING AND APPARATUS FOR PERFORMING THE SAME

摘要

A method comprises the step of placing a package structure into a mold chase, and upper surfaces of device dies in the package structure coming in contact with a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, and the injection port is positioned on one surface of the mold chase. During injection of the molding compound, a ventilation step is performed through a first ventilation port and a second ventilation port of the mold chase. The first ventilation port has a first flow rate, and the second port has a second flow rate different from the first flow rate.