发明名称 |
Method and apparatus for processing a plastic part and comprising a lathe system |
摘要 |
The invention relates to a method for processing a plastic part by using a lathe system and comprises the following steps:
rotating the plastic partmashing of a tools cutting edge with the plastic part,generating a gaseous and a liquid flow,whereby the chip, which is lifted of the plastic part, is first surrounded by the gas flow and subsequently by the liquid flow
Moreover the invention relates to a lathe system to carry out the said method which comprises a rotatable workpiece receptacle, a tool fitted with a tool cutting edge, and a chip removal device. The chip removal device is fitted with a gas flow generator, having a gas nozzle which points towards the tool and with a liquid flow generator having a liquid channel configured below the tools cutting edge. |
申请公布号 |
US9216486(B2) |
申请公布日期 |
2015.12.22 |
申请号 |
US201213622042 |
申请日期 |
2012.09.18 |
申请人 |
OptoTech Optikmaschinen GmbH |
发明人 |
Mandler Roland |
分类号 |
B23B27/10;B23Q11/00;B23Q11/10;B23Q11/14;B23B25/00;B32B27/00 |
主分类号 |
B23B27/10 |
代理机构 |
Clark & Brody |
代理人 |
Clark & Brody |
主权项 |
1. A method for processing a plastic part (30) using a lathe system (1), comprising the following steps:
a) rotating the plastic part (30); b) machining of the plastic part (30) with a tool cutting edge (4);
further characterized by the following steps: d) providing a liquid flow (F), a surface of the liquid flow facing the tool cutting edge (4), and a gas flow (G), the tool cutting edge positioned between the gas flow (G) and liquid flow (F); e) whereby a chip (32), which is lifted off of the plastic part, is a flowing chip (33); f) blowing the chip (32) by means of the gas flow (G) into the liquid flow (F) such that the chip (32) is first surrounded by the gas flow (G) and subsequently by the liquid flow (F). |
地址 |
Wettenberg DE |