| 发明名称 | Solder and die-bonding structure | ||
| 摘要 | A solder includes zinc as a main component and the solder contains 6 to 8 mass percent of indium. A solder includes zinc as a main component, wherein the solder contains only indium. In a die-bonding structure in which a semiconductor chip is connected to a bonded member by a solder, the solder made of zinc as a main component and contains indium. | ||
| 申请公布号 | US9216478(B2) | 申请公布日期 | 2015.12.22 |
| 申请号 | US201414146086 | 申请日期 | 2014.01.02 |
| 申请人 | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI | 发明人 | Maeno Kazuhiro |
| 分类号 | H01L23/48;H01L23/52;H01L29/40;C22C18/00;C22C18/04;B23K35/28;B23K35/26;H01L23/00 | 主分类号 | H01L23/48 |
| 代理机构 | Greenblum & Bernstein, P.L.C. | 代理人 | Greenblum & Bernstein, P.L.C. |
| 主权项 | 1. A solder comprising zinc as a main component, bismuth, phosphorous, 6 to 8 mass percent of indium, 5 mass percent of aluminum, and 0.1 mass percent of germanium. | ||
| 地址 | Aichi-ken JP | ||