| 摘要 |
The present invention relates to a semiconductor package, and a manufacturing method thereof. More specifically, the present invention relates to a semiconductor package which improves a heat radiation characteristic to emit the heat generated from a semiconductor chip to a lower part and an upper part thereof by inserting a first heat spreader between a substrate and the semiconductor chip, and arranging a second heat spreader to the upper part of the semiconductor chip, and to a manufacturing method thereof. |
