发明名称 INDUCTION HEATING MOLD APPARATUS
摘要 The present invention relates to an induction heating mold apparatus. According to the present invention, the induction heating mold apparatus comprises: a mold (110); an induction heating coil (160) to heat the mold (110) if a high frequency current is applied thereto from a high frequency generation device; and a non-conductive and non-magnetic shielding member (120, 130, 140) to cover the mold (110) to allow for formation of an induction magnetic field created by the induction heating coil (160) only in an area into which a forming resin is injected, and block formation of the induction magnetic field in an opposite area of the area into which the forming resin is injected. Accordingly, heating time by a high frequency output under an equal condition can be shortened, and an optimal temperature can be reached more quickly. A resin injection speed can be increased to increase injection productivity of a product.
申请公布号 KR20150142294(A) 申请公布日期 2015.12.22
申请号 KR20140070825 申请日期 2014.06.11
申请人 JARWON ELECTRONICS CO., LTD. 发明人 LEE, MIN KI
分类号 B29C33/08;B29C45/73 主分类号 B29C33/08
代理机构 代理人
主权项
地址