Electronic package for millimeter wave semiconductor dies

摘要

A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.

主权项

1. An electronic package for semiconductor dies, comprising:
a multilayer circuit board constructed from a dielectric material and having at least two layers surrounding a cavity, a top surface and a bottom surface; a high frequency circuit board having a bottom face and constructed from a dielectric material and affixed to said multilayer board by electrically conductive glue, wherein the high frequency circuit board comprises a ground plane; at least one plated through hole connecting the at least two layers, for electronic signal connection; and a semiconductor die comprising at least one pad for high frequency signal, at least one pad for high frequency ground and a multiplicity of pads for direct current (DC) or control, wherein a top face of said semiconductor die is electrically attached to a bottom face of said high frequency circuit board by at least two conductive bumps, such that each conductive bump is attached to one pad, and wherein a bottom face of said semiconductor die is thermally connected to at least one of the at least two layers by thermal interface material.