| 摘要 |
The present invention relates to a semiconductor package, and a method for manufacturing the same. According to the present invention, the semiconductor package comprises: a lower package including a lower substrate, a lower semiconductor chip, and a lower molding layer for exposing an upper surface of the lower semiconductor chip; bumps separated from the lower semiconductor chip on the lower substrate; a lead frame arranged on the lower semiconductor chip and the bumps, and electrically connected to the bumps; and an upper package arranged on the lead frame, and electrically connected to the lead frame. |
