发明名称 PRINTED SUBSTRATE AND CUTTING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a printed substrate and a cutting method therefor, enabling separation of L-shaped printed substrates simply by folding the substrates, by the connection of only a central side out of three combined sides formed when the L-shaped printed substrates are combined in upside-down disposition, with the elimination of a sacrificed substrate at L-shape formation.SOLUTION: Among the combined three sides of L-shaped printed substrates (101, 102) of the same size each having a short side length which is 1/2 of a long side length or smaller, only central sides (106) are connected. Further, one L-shaped printed substrate (101, 102) is connected to another printed substrate (101, 102) in upper and lower positions using sacrificed substrates (103, 104).
申请公布号 JP2015230997(A) 申请公布日期 2015.12.21
申请号 JP20140117239 申请日期 2014.06.06
申请人 CANON INC 发明人 HAGIWARA YUICHI
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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