| 摘要 |
PROBLEM TO BE SOLVED: To provide a white thermosetting silicone composition for an optical semiconductor element case, having low light transmittance, excellent moldability and hardly generating burr when molded, and a case composed of a cured article of the composition for loading an optical semiconductor element such as an LED.SOLUTION: A white thermosetting silicone composition for an optical semiconductor device is provided which contains (A) resinous organopolysiloxane having a hydroxyl group and a weight average molecular weight in terms of polystyrene of 500 to 20,000, (B) organopolysiloxane having a linear diorganopolysiloxane residue, (C) a white pigment, (D) an inorganic filler other than (C) component, (E) a silane coupling agent having a refractive index differing from that of (A) resin organopolysiloxane by 0.02 or more and the boiling point at ambient pressure of 200°C or more and (F) a curing catalyst. |
