POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE FILM

摘要

PROBLEM TO BE SOLVED: To provide a polyimide precursor composition providing a polyimide film stably exhibiting high adhesiveness regardless of difference of time till an initiation of a heat treatment from application and capable of easily being peeled from a substrate.SOLUTION: There is provided a resin composition containing 100 pts.mass of (A) a polyimide precursor represented by the following general formula (1) and over 10 pts.mass and 50 pts.mass or less of (B) specific silicone represented by both terminal amine modified methylphenylsilicone. (1), where Ris each independently selected from a group containing a hydrogen atom, monovalent aliphatic hydrocarbon having 1 to 20 carbon atoms and a monovalent aromatic group having 6 to 20 carbon atoms, Xrepresents a bivalent organic group having 4 to 32 carbon atoms and Xrepresents a tetravalent organic group having 4 to 32 carbon atoms.