发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To inhibit the damage from occurring in a glass substrate in a wiring board equipped with the glass substrate as a core layer.SOLUTION: A wiring board includes: a glass substrate; a first layer containing first wiring, a first resin layer and first via wiring; and a second layer which is arranged on the first layer and formed by laminating at least one set or more of second wiring, a second resin layer and second via wiring. Then, in this wiring board, the volume ratio of the first wiring and the first via wiring to the volume of the first layer is smaller than that of the second wiring and the second via wiring to the volume of the second layer.
申请公布号 JP2015231004(A) 申请公布日期 2015.12.21
申请号 JP20140117397 申请日期 2014.06.06
申请人 NGK SPARK PLUG CO LTD 发明人 IWASAKI MASATAKA;SEKI TOSHITAKE;MATSUURA HIROYUKI;HORIO TOSHIKAZU;YAMAMOTO HIROSHI
分类号 H05K3/46 主分类号 H05K3/46
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