| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method that can perform cleaning and drying processing on a substrate while suppressing liquid residue.SOLUTION: Discharge of processing liquid PL is started by a nozzle 83 under the state that a substrate W having a water-repellent film formed on the surface of the substrate W is held and rotated by a spin chuck 81 or the like. The processing liquid PL is discharged to a position which is away from the center portion AX1 of the substrate W by a preset distance D, and made to flow so as to be bundled into one stream on the substrate W just after the start of the discharge of the processing liquid PL. Accordingly, occurrence of minute droplets can be suppressed. Furthermore, the nozzle 83 is moved to the outside of the substrate W while the processing liquid PL is continuously discharged from the nozzle 83. Accordingly, the whole flow of the processing liquid PL can be moved to the outside of the substrate W while the processing liquid PL is kept to be bundled as one stream on the substrate W. The inside of the flow of the processing liquid PL is set to a dry area. |
