| 摘要 |
PROBLEM TO BE SOLVED: To improve drying efficiency of an undersurface of a wafer while preventing intrusion of liquid supplied to the undersurface of the wafer into a discharge port of drying gas.SOLUTION: A wafer liquid treatment apparatus includes: a wafer holding and rotating mechanism (30) for holding a wafer (W) in horizontal posture and rotating the wafer (W) around a vertical axial line; a liquid discharge unit (40) arranged under a center portion on the undersurface of the wafer and having a head portion (42) including a liquid discharge port (43a) for discharging treatment liquid toward the undersurface of the wafer; and an enclosure member (31c) surrounding the liquid discharge unit through a gap and having an aperture (31d) on an upper surface. In the aperture, a gas discharge port (82) for discharging drying gas toward the undersurface of the wafer in an obliquely upward and outward direction is formed between the liquid discharge unit and the enclosure member. The head portion (42) of the liquid discharge unit is projected to the outside of the gas discharge port and covers the gas discharge port from above. |
