发明名称 LIGHT-AND-HEAT-CURABLE ADHESIVE FOR INKJET, PRODUCTION METHOD OF ELECTRONIC PART AND ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a light-and-heat-curable adhesive for inkjet which enables high-accuracy formation of an adhesive layer with the adhesive hardened and suppresses formation of voids in the adhesive layer.SOLUTION: A light-and-heat-curable adhesive is used by application with an inkjet device. The adhesive is used by irradiating with light to promote hardening and then hardening by heating, comprises a photo-curable compound, a thermosetting compound, a photopolymerization initiator and a thermosetting agent and contains a thermosetting agent of formula (1) as the thermosetting agent. In formula (1), R1 to R15 are individually a hydrogen atom, an allyl group or 1-18C alkyl group; n is an integer of 0-10.
申请公布号 JP2015229758(A) 申请公布日期 2015.12.21
申请号 JP20140117871 申请日期 2014.06.06
申请人 SEKISUI CHEM CO LTD 发明人 FUJITA YOSHITO;TAKAHASHI RYOSUKE;MAENAKA HIROSHI;INOUE TAKANORI;UEDA TSUNEHISA;WATANABE TAKASHI;TANIGAWA MITSURU
分类号 C09J4/00;B05D1/26;B05D3/06;B05D5/10;B05D7/00;B05D7/24;C09J4/02;C09J11/04;C09J11/06;H01L21/52;H01L25/065;H01L25/07;H01L25/18 主分类号 C09J4/00
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