发明名称 |
LIGHT-AND-HEAT-CURABLE ADHESIVE FOR INKJET, PRODUCTION METHOD OF ELECTRONIC PART AND ELECTRONIC PART |
摘要 |
PROBLEM TO BE SOLVED: To provide a light-and-heat-curable adhesive for inkjet which enables high-accuracy formation of an adhesive layer with the adhesive hardened and suppresses formation of voids in the adhesive layer.SOLUTION: A light-and-heat-curable adhesive is used by application with an inkjet device. The adhesive is used by irradiating with light to promote hardening and then hardening by heating, comprises a photo-curable compound, a thermosetting compound, a photopolymerization initiator and a thermosetting agent and contains a thermosetting agent of formula (1) as the thermosetting agent. In formula (1), R1 to R15 are individually a hydrogen atom, an allyl group or 1-18C alkyl group; n is an integer of 0-10. |
申请公布号 |
JP2015229758(A) |
申请公布日期 |
2015.12.21 |
申请号 |
JP20140117871 |
申请日期 |
2014.06.06 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
FUJITA YOSHITO;TAKAHASHI RYOSUKE;MAENAKA HIROSHI;INOUE TAKANORI;UEDA TSUNEHISA;WATANABE TAKASHI;TANIGAWA MITSURU |
分类号 |
C09J4/00;B05D1/26;B05D3/06;B05D5/10;B05D7/00;B05D7/24;C09J4/02;C09J11/04;C09J11/06;H01L21/52;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
C09J4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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