| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite material, etc. that has a low thermal expansion property and a high thermal conductivity property suitable for a buffer layer of a power module.SOLUTION: A power module 1 has a substrate 10 having a semiconductor chip 16 mounted on one surface thereof, a buffer layer 11 formed on another surface of the substrate 10, and a cooler 12 which has a planar substrate 12a and a cooling part 12b provided on one surface of the substrate 12a, and is adhesively attached to the buffer layer 11 through another surface of the base part 12a. The buffer layer 11 is a composite material which is formed by accelerating mixture powder of copper powder, and powder of additive material formed of one of chromium, titan and tungsten carbide together with gas, and the mixture powder is sprayed and deposited onto the surface of a base material while the mixture powder is kept under a solid-phase state. |
