| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a package for an electronic device capable of thickening a terminal and accurately forming the terminal.SOLUTION: A method for manufacturing a package for an electronic device includes the steps of: preparing an insulating substrate and a metal plate; sticking the insulating substrate and the metal plate; and forming a terminal by removing a part of the metal plate. The terminal forming step preferably removes the metal plate by etching. In the preparing step, a constituent material of the insulating substrate preferably includes glass. The thickness of the terminal is preferably not less than 50 μm. |
