DICING METHOD OF WAFER LEVEL PACKAGE, WAFER LEVEL PACKAGE, AND DICING BLADE

摘要

PROBLEM TO BE SOLVED: To provide a dicing method of a wafer level package capable of achieving excellent light shielding properties without increasing man-hours.SOLUTION: The dicing method of a wafer level package includes a dicing step for dicing the wafer level package. The dicing step includes dicing a light-shielding groove for shielding incident light of a predetermined wavelength from a cut area exposed when being made to be individual pieces with a dicing blade formable at the cut area.